先前windwithme風分享過幾篇Intel與AMD幾款新平台的組合測試,本篇主要是Intel 13代平台中CP頗高Core i5-13500與中階B760 ITX主機板,再搭配幾款手邊零組件裝機而成的硬體實測分享文。

希望能以自身的親身使用經驗來分享每一款3C產品在競爭激烈的市場上,扮演著什麼樣的定位,以設計、用料以及優缺點等各項環節分享,提供網友或消費者在選購前更精準的產品分析。 In current tough competitive market, you should know the product position, design concepts, components usage, pros and cons before you buy it. I would like to share my own experience to help you before making right decisions.



