影片內動態外觀與條狀圖數據對比可更快了解本篇內容:
年初AMD與Intel都推出新架構的中階晶片組,Intel上一代晶片組高階Z790、中階B760改腳位後為Z890、B860;AMD從原先X670、B650跳號為X870,看來是想跟上對手的數字,選購時容易造成混亂…
希望能以自身的親身使用經驗來分享每一款3C產品在競爭激烈的市場上,扮演著什麼樣的定位,以設計、用料以及優缺點等各項環節分享,提供網友或消費者在選購前更精準的產品分析。 In current tough competitive market, you should know the product position, design concepts, components usage, pros and cons before you buy it. I would like to share my own experience to help you before making right decisions.
影片內動態外觀與條狀圖數據對比可更快了解本篇內容:
年初AMD與Intel都推出新架構的中階晶片組,Intel上一代晶片組高階Z790、中階B760改腳位後為Z890、B860;AMD從原先X670、B650跳號為X870,看來是想跟上對手的數字,選購時容易造成混亂…
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My first visit to COMPUTEX dates back to 2004—hard to believe it’s been 22 years since then. Over the years, the tech industry has seen its ups and downs, from quieter periods to the explosive growth of the gaming era, and now the resurgence brought on by AI. Through it all, COMPUTEX has stood as a witness to the ongoing evolution of technology and innovation.
Ever since NVIDIA sparked the AI trend during COMPUTEX 2023, the buzz around AI has remained strong. Over the past two years, most brands have been working hard to align their new hardware and software with AI capabilities.
This year’s COMPUTEX 2025 carries the theme “AI NEXT”, continuing the momentum from last year. Once again, tech giants NVIDIA, AMD, and Intel are taking the stage in Taipei, with global media coverage driving excitement to new heights.