windwithme X58 part 5-GIGABYTE EX58-UD4P High-end with reasonable price

Since 2008/11, Intel launched LGA1366 structure, all MB makers announced their corresponding X58 boards and the price is over 300USD.

Even though Core i7 is positioning in high end, but most users are looking for more reasonable price boards to make platform cheaper.

It can make LGA775+Quad core CPU users to upgrade to Core i7 platform.



X58 has been launching for 2 months, every maker also announce some cheaper solution.

GIGABYTE is the fastest. Except the top EX58-EXTREME, GIGABYTE also has a full series X58 boards, UD5/UD4P/UD4/DS4/UD3R.

The price is between 210~270USD. All series is using X58+ICH10R. This price is quite reasonable.



This time my review is GIGABYTE GA-EX58-UD4P and the price is 270USD.

Let’s look at the box focus on GIGABYTE latest 2 oz PCB.





Accessories

UD4P includes SLI bridge and high end 3 Way bridge





GIGABYTE EX58-UD4P body













Left lower corner

2 X PCI-E X16

2 X PCI-E X8(these 3 PCI-E support SLI/CrossFireX 3WAY technology)

1 X PCIE X4

1 X PCIE X1

2 X PCI

Realtek 8111D is LAN chip supports Teaming technology

Realtek ALC889A supports 7.1 channel and High Definition Audio technology. DolbyR Home Theater surround audio technology.

PCB is MADE IN TAIWAN





Right lower corner

6 X SATAII(provided by ICH10R), support RAID 0, RAID 1, RAID 5 and RAID 10

2 X SATAII, support RAID 0, RAID 1 and JBOD

1 X IDE

Dual BIOS for dual protection. Also provide diagnostic LED.





Right upper corner

6 X DIMM DDR3 support 800/1066/1333/1867/2133/2400 and 2133/2400 are special spec.

DRAM  has 2 phase PWM and 24pin is nearby. POWER/RESET buttons.

New version blue/white DIMM slots which is matched with PCB color.

This LED is for DES. The users can observe DES status.





CPU VRM uses 6+6 phase and supports DES advanced.

The latest VRD11.1 bundle with Intel i7 CPU can bring Intel energy saving into full play.





IO part

8 X USB 2.0

1 X RJ-45

1 X S/PDIF

1 X 1394

Here is also a Clear COMS button.





EX58-EXTREME thermal module and NB also has 2 phase PWM.







Boot up screen





BIOS main page





M.I.T. frequency and voltage setup page





CPU Vcore 0.5000~1.90000V

QPI/VTT Voltage 1.075~1.995V

IOH Core 1.000~2.000V

ICH I/O 1.050~2.500V

DARM Voltage 1.300~2.600V





CPU Features





Clock Control





Momory frequency ratio





PC Health Status





Press F8 in main page can enter Q-Flash mode to flash BIOS





Configuration

CPU: Intel Core i7 Extreme 965

MB: GIGABYTE EX58-UD4P

DRAM: CORSAIR Dominator 2GBX3 DDR3 1866C9D

VGA: MSI N9600GT Diamond SLI

HD: SAMSUNG 250GB

POWER: Corsair HX1000W Modular Power Supply

Cooler: Thermaltake BigTyp VP/JETART Nano Diamond





DRAM

CORSAIR Dominator 2GBX3 DDR3 1866C9D

The official spec for X58 platform is DDR3 1866 CL9 9-9-24 1.65V



DDR3 1862 CL8 8-8-24 1T,BIOS 1.66V

SP2004 3 X Blend mode, stable in full load at 5.73G





DDR3 2004 CL9 9-9-24 1T,BIOS 1.66V

SP2004 3 X Blend mode, stable in full load





DDR3 1862 CL9 9-9-24 1T,BIOS 1.66V

Sandra Memory Bandwidth-32598MB/s

EVEREST Memory Read-20122MB/s





DDR3 2064 CL9 9-9-24 1T,BIOS 1.68V

Sandra Memory Bandwidth-35353MB/s

EVEREST Memory Read-21363MB/s





As Intel new structure supports 3 channel DDR3, the best advantage of LGA1366 is DDR3 performance.

It’s almost 3 times faster than previous DDR2/DDR3 platform. It’s good news for users who demand lots of memory resource.

UD4P is perform well in DDR3 OC. It almost only needs 1.6~1.7V to reach the score above.

Also, the DDR3 bandwidth, X58 products also have very good score.



CPU

Intel Core i7 Extreme 965

OC 166X24=>3983.8Mhz

DDR3 1993 CL8 9-9-24 1T



Hyper PI 4X32M





CrystalMark 2004R3





CINEBENCH R10





Intel Core i7 920

211X19=>4009.2Mhz

DDR3 1688 CL8 8-8-24 1T

Hyper PI 4X32M





Frequencyis depending on QPI/VTT Voltage.

Core i7 clock and DDR3 voltage are varied in each CPU. This is the main difference with 775 platform.

UD4P is stable at 211with Quad core in PI 32M



3D

MSI N9600GT Diamond SLI mode



3DMARK VANTAGE





Crysis Benchmark





X58 also support both CF and SLI. This is excellent for the users who demand for 2/3 VGA cards.



GIGABYTE EX58-UD4P conclusion

Good

1.UD4P uses 2oz and UD3 which are same as EXTREME.

2.All Japanese solid capacitors. NB and DIMM also have extra 2 phase PWM.

3.BIOS provides vary voltage and frequency and also built-in Power/Reset/Clear CMOS buttons.

4.DDR3 has excellent 3 channel performance and supports SLI/CFX

5.6+6 phase PWM and DES, Intel latest VRD11.1 PWM spec and combine with GIGABYTE DES advanced for better energy saving.



Bad

1.LGA 1366 platform is still expensive currently.

2.Make audio module will be better.



Performance ★★★★★★★★☆☆

Components ★★★★★★★★★☆

Outlook     ★★★★★★★★☆☆

C/P Value    ★★★★★★★★☆☆



GIGABYTE UD4P and EXTREME only have some difference : the hybrid thermal pipe, 2 SATA ports and dual GbE LAN.

UD4P in PCB, components, BIOS items and performance are not far behind EXTREME.

X58 supports 2 VGA CF/SLI technology also make Intel platform be more powerful in 3D graphic performance.



As the naming rule, Intel X is the high end series. In the beginning, the boards are all over 300USD.

After the revision, like simplify the function and accessories, the price could be around 200USD.



Furthermore, Intel also positions Core i7 CPU in high end product. The price will be close to LGA775+Quad Core CPU.



Most users should feel the LGA1366 platform is too expensive. However, it’s just the new structure to the market.

In the beginning, Core i7 in high price is also the normal marketing strategy. LGA775 also took 2-3 years to become mainstream product.

LGA1366 launch can replace current LGA775 high end product and push LGA775 middle end product to drop price.

Users just decide by your own budget to see if you want high end LGA1366 or mainstream LGA775. At least the users have more choices now.:)