高效率靜音之銅牌PSU-Antec TurePower New 750W拆殼實測

來自美國的Antec品牌對於台灣消費者來說可能比較陌生
它也是最近才開始在台灣有通路的一個新品牌產品
印象中小弟常在香港或是美國的網站看到此品牌的產品訊息
而且那些網路上的網友討論Antec的評價都還算不錯。

Antec主要的產品在於Power Supply與Case兩種
參考Antec的網站可以看到Power Supply已經推出相當多的系列
目前最新的是TruePower New系列，共有550/650/750W三種規格。

此回的主角就是Antec TurePower New系列中最高階的750W
在80PLUS的網站拿到銅牌，有效轉換功率數據達到86.31%
產品外包裝走的是簡約風，外盒較小且紙質較薄，質感方面沒有那麼好
也可以說是走節能風，但身為中高階的產品，在外包裝材質與美工上應該可以更好才是。


內附配件
固定用螺絲、簡易說明書、電源線材


模組化部份的擴充線材
2 X PCI-E 6 PIN
6 X HDD 4 PIN
6 X SATA


包裝保護做得很好


Antec TurePower New 750W本體
以下簡稱TP-750，產品大小為86mm (H) x 150mm (W) x 150mm (D)


散熱風扇尺寸120mm，最低轉速時只有16.9dBA
最高轉速時有85CFM的風量，轉速依機體溫度做溫控變化


以下為非模組化的接頭
1 X ATX 20 + 4 PIN
1 X ATX 4 PIN
1 X ATX 8 PIN


2 X PCI-E 6+2 PIN
3 X SATA
3 X HDD 4 PIN
1 X Floppy
Antec這方面的設計不同於一般模組化或傳統型的PSU
採用類似半模組化的設計，一般使用下接頭提供一定的數量，在高負載時再搭配模組化線材使用
這種設計算是比較折衷的方式，便利性還不錯


後方外殼設計為蜂巢式散熱孔
Active PFC規格，適用於110~240v室電，此處應該有個貼紙標示會更明確。


模組化擴充接孔處
很清楚的把12V各路標示出來，讓裝置的耗電量比較好分配


TP-750產品規格
+12V有4路，總共62A，最高可達744W


拆開外殼觀看內部構造
(拆開PSU外殼會破壞保固貼紙.喪失原廠保固，請網友若要拆開前需要斟酌)




全日系電容增加產品耐用度


雙層PCB，類似技嘉目前在主推的2oz雙層PCB用料
小弟第一次在PSU產品上看到此用料，感覺很新奇


Antec標榜工業等級的保護裝置




散熱風扇使用ADDA，印象中是相當靜音的風扇品牌
AD1212HB-A7BGL，12V 0.37A，雙滾珠軸承風扇



測試平台
CPU: Intel Core i7-750
MB: MSI P55-GD80
DRAM: CORSAIR CMD8GX3M4A1600C8
VGA: GIGABYTE GTX260 OC SLI + MSI R4890 CYCLONE DDR5 1GB
HD: CORSAIR CMFSSD-64GB2D (RAID 0)
POWER: Antec TurePower New 750W
Cooler: Mega Shadow(Deluxe Edition)


OS系統設定值
CPU 210.5 X 20 => 4209.6Mhz
DARM 8GB DDR3 1682 CL8 8-8-24 1T


OCCT V3.1.0
POWER SUPPLY模式，Optimail (7)


以上為此次規格平台，顯示測試過程中耗電狀況
這部份採用Power Angle為數據參考

進入系統桌面下 - 285~286W


執行OCCT中Power Supply測試項目
i7-750 OC 4.2GHz 四核心滿載加上GTX260 SLI也同步運作 - 808~840W


Power Angle測的數據僅供參考使用，只是個大約耗電量值，而非十分精準的數據
測試中雖然無法讓4890運作到3D效能，使它全速滿載測試
不過多安裝一張4890可以讓耗電量增加60~80W左右，對於高負載的測試不無小補。

CPU溫度變化


系統溫度變化


CPU電壓變化
待機時約1.45V，全速運作時幾乎都停在1.48V
另外CPU電壓跳動範圍部份與主機板設定比較有關


3.3V
落在3.34V，從頭到尾皆一直線，沒有跳動的變化


5V
大約落在5.09~5.13V，電壓落差在0.78%左右


12V
大約落在11.83~12.14V，電壓落差在2.55%左右


3V表現優秀，重覆測試幾次也鮮少會有跳動出現
5V電壓落差也不大，比在一般可容許的電壓誤差值5%內低上許多
12V是在測試中落差比較大的地方，主要也是因為採用LGA 1156平台，12V比以往耗電量高不少。
TP-750W在12V落差2.55%也屬於中上的表現
大部份12V時間落在11.97~12.14V，落差降到只有1.40%

在高負載全速運作時，TP-750本體的溫度往上拉高，用手摸約55~60度左右，出風量也相對增高。
一般使用下風扇所發出的噪音也幾乎聽不到，發出的噪音相當地小
在超越規格的高耗電狀況下，本體因為溫度而把轉速提高，但小弟因為VGA風扇的噪音而聽不到PSU發出的噪音。

最後是比較精準的電表測量
待機時
5V測出來為5.18V，比起主機板測出來的5.13V還要高一些


OCCT全速運作時
電壓範圍5.19V，電壓升到比待機時還高0.01V


待機時
12V測出來為12.11V，比起主機板測出來的12.14V還要低一些


電壓範圍12.07V，電壓降到比待機時低，但落差範圍比OCCT測試小很多


12V電壓範圍在於12.07~12.11V，此時差距大幅縮小到0.33%
在電表的測量下，3V/12V不管是待機或是全速都沒有跳動的狀況
最近使用過的幾款PSU都還沒有那麼穩的電流表現，所以對小弟來說，這是一個蠻少見的狀況。

Antec TurePower New 750W使用心得總結
優點
1.美國品牌產品用料紮實，電壓波動範圍低
2.半模組化的設計，使用搭配伸縮彈性較高
3.通過80PLUS銅牌認證，轉換功率高達86.31%
4.標榜使用全日系電容，雙層PCB用料與雙滾珠軸承風扇
5.溫控式散熱風扇，一般使用時風扇相當地靜音

缺點
1.外包裝設計與質感看起來像入門產品，這部份還有加強的空間
2.高負載全速運作時，機體溫度偏高

效能比 ★★★★★★★★★☆
用料比 ★★★★★★★★★☆
規格比 ★★★★★★★★★☆
外觀比 ★★★★★★★☆☆☆
性價比 ★★★★★★★★☆☆


TurePower New是Antec最新系列的PSU產品，目前750W的價位約台幣6290元
比起市場大品牌的PSU產品價格來說，Antec TP-750的市場價位會更便宜一些。
實際在幾個測試後，Antec PSU整體使用起來的感覺不錯
尤其在用料與電壓穩定度更是值得稱讚的地方，但在溫度控制與外包裝方面還是需要再加強。

Antec在近期開始在台灣市場發售一系列的產品線，剛開始可能能見度會比較低
目前Antec原廠提供五年保固，前三年故障可換新品，保固方面後續應該可以安心
不過相信Antec在市場上能夠多提供消費者一個可以考慮的高品質PSU產品。

"BIOSTAR TPOWER I55 - Intel LGA1156" ROCK

With the coming of September, the latest Intel LGA 1156 platform of high-intermediate level is also coming.
On this platform, Intel recently added the support of Core i7 processor, so in future both Core i5 and Core i7 processors can be used,
the successful development that can improve the efficiency more effectively.

At present, the sale of LGA 1156 platform is not available before September,
but, despite of the fact that the economic is still depressed,
there have been a lot of MB manufacturers planning promotion for more attractive products based on this new platform.
Currently, the price of X58 is at US$ 200~300; the price of P55 motherboard of LGA 1156 is expected to be sold at about US$ 100~300;
and the price of most products of P55, at about US$ 120~200, the same product level as P35 and P45 before.

Why is the price of P55 as almost high as that of X58? Actually, X58 is deemed as a high level product;
P55, higher than intermediate level and lower than high one.
Therefore, the price of P55 and of X58 is nearly the same; as for X58, for several months there have been many product series based on this chipset,
and they are priced at about US$ 200. At first, the price of P55 should be probably the same as that of P45,
with intermediate level at US$ 150~200, or with high level at nearly US$ 300.

We are going to introduce BIOSTAR P55 product, the highest level version, the price of which is at about US$ 200.
The most important feature of BIOSTAR products is easy to overclock, and supplies at reasonable prices.
The price of highest-level P55 is the same as that of elementary-level X58.

Full view of BIOSTAR TPOWER I55






BIOSTAR’s design and material are much better than ever. It is also one of the best MB manufacturers.
My favourite blue and big heat pipe make the quality excellent.

Down-left of the motherboard
2 X PCIE X16(support ATI CrossFireX and Nvidia SLI technology， X8+X8 bandwidth)
1 X PCI-E X4
2 X PCI-E X1
2 X PCI
Dual LAN Intel 82578/Realtek RTL8111DL, support 2Gb LAN Teaming
For multi VGAs, X series chipset uses X16+X16 bandwidth,
but P series chipset, limited X8+X8 bandwidth.


Down-right of the motherboard
6 X SATAII(ICH10R，support Raid0，1，5)
Power/Reset button and debug LEDs
1394a uses LSI chipset


Up-right of the motherboard
4 X DIMM DDR3，support 800/1066/1333/1600/2000+
1 X IDE
24PIN power input，DDR3 uses 2phase


Power supply uses 8 phase CPU Power，4 phase CPU NB


IO
8 X USB 2.0
2 X eSATA
2 X Gigabit LAN
1 X 1394a


Although north and south bridge are combined in P55, BIOSTAR still add a big heat sink on the traditional north bridge location,
the design that makes not only the appearance more attractive, but also cooler area bigger.


Picture of LGA 1156 with Core i7 870


The lacquered quality of heat pipe is great, with amazing design of finned plates and cooler area.


LGA 1156 platform is becoming available in the market in less two months. According to more and more news from the Internet,
Intel is going to categorise its products into three kinds of platforms— LGA 775, i3/i5/i7(LGA 1156), i7/i9(LGA 1366).
As customers, they may think there are too many product series and different sockets; hence, they easily feel confused and do not know how to choose. All in all,
the launch of new products can renew the old product series faster.

Since LGA 1366 is deemed as high-level products, it is inadequate for LGA775 for non high-level products.
So, the coming of LGA 1156 can make Intel platforms more complete, and customers, depending upon their budget, therefore have more choices.
Let’s look forward to waiting MB manufacturers’ products, and price of Intel LGA 1156 CPU.

Intel upcoming performance platform w/ LGA1156-sneak peek of MSI P55-GD65

Core i7, new CPU platform, featured as socket 1366, was launched by Intel last year.
Nevertheless based on this structure, it has been positioned as high-end product until now and even in the future.
During this period, market demand below high-end served by socket 775 old structure needs to be fulfilled as well.   

There’s a rumor saying socket 1156, applicable for CPU marked as Core i5 will replace those between high and middle end.
However, recently the classification of product line has slightly changed.
Socket 1366 remains the high-end platform.
Besides Core i7, another platform featured as 6 cores, 12MB cache, will be launched.
They call it- i9 Regarding socket 1156,
no only Core i5 but also Core i7 supports 1156 pins meaning users have to distinguish by LGA 1366 or LGA 1156 instead of Core i5 or Core i7.
Back to our spotlight, MSI P55-GD65, socket 1156 mainboard, is not ranked as MSI’s highest-end by telling from its Marketing name.

Panorama of MSI P55-GD65






Bottom Left
2X PCIEX16(Supports ATI CrossfireX and Nvidia SLI Technology, bandwidth X8+X8)
1 X PCI-E X4
2 X PCI-E X1
2 X PCI
The same market position as former product line.
X series chipsets have X16+X16 bandwidth with multi-VGA while P series are still limited with X8+X8 bandwidth.


Bottom Right
7 X SATAII
1 X IDE


Top Right
4 X DIMM DDR3
1 X Floppy
24-pin Power Input
Blue area is V-Check points, for users who need to measure system voltage by ammeter which indicate CPU Vcore/CPU VTT/DDR VCC/PCH.


Top Left
6+1 phrase CPU Power supply, support Dr.MOS Technology.


IO


What socket 1156 differs from 1366 is that it doesn’t have DDR3 trial channels and QPI Technology.
P55 platform principally has DDR3 dual channels.
Although the performance is behind X58 trial channel structure, P55’s support range is enhanced to DDR3-1333.


Hook’s slightly different from other socket platforms.



North bridge function is integrated on CPU. The function of P55 chipset is only South bridge.
The MSI heatsink on P55 chipset looks quite nice. There’s MSI OC Genie controlling chip on the left.


OC Genie is spontaneous overclocking chip. Users only press the bottom to overclock very conveniently.
Black +/- button named Direct OC, used for switching CPU Base Clock directly as well as instant hardware overclocking.


MSI named the heatpipe Superpipe this time.
Heat transferring with 8mm thickness Superpipe is supposely better than traditional heatpipe, of which the fact needs to be confirmed by testing.




I perceived that in recent X58 and P55 chipsets, mainboard are more and more user-friendly on material and design.
Every manufacturer desires to present new technology, new material, or new function to reinforce competitiveness of its brand as well as animating the market.

Web news says that CPU on socket 1156 will hit retail market after September.
Every main motherboard players are so hot to trot for P55 product launch.
Hopefully, new platform with socket 1156 for middle-to- high end market is ideal for those who look for high C/P products.